circuits in plastic

Circuits in plastic

The Circuits in Plastic manufacturing technology is an alternative to traditional PCB technology. As a more environmentally friendly way to realize electronic assemblies, it can be seen as a "greener" production technique. Furthermore it reduces the manufacturing costs of both circuits and electronic systems Professor David Thiel and Mr. MadhusudanRao Neeli of CWMA, Griffith University have developed a new and efficient technology for circuit board manufacture and packaging that contains no harmful substances as stipulated under the RoHS directive and is environmentally friendly. It is also possible to use recyclable plastics meaning it also conforms to the WEEE directive. In addition the setup and manufacturing, costs of this technology can be significantly lower than that of the standard PCB manufacturing method. The technology is called "Circuits in Plastic". From the 1st of July 2006 [2002/95/EC Art. 4.1], all electrical products marketed within the E.U. must conform to E.U. directives 2002/95/EC and 2002/96/EC otherwise commonly known as WEEE and RoHS, respectively. These directives will have implications on many electronics companies, even if they are not marketing to the EU directly. As more countries adapt similar legislation the majority of component manufacturers will phase out their non-compliant. For most electronics companies, conforming to these directives will mean the elimination of lead-based solder from this, and where possible, to increase the recyclability and/or reusability of their electronic products. The problem confronting electronics companies have is how to produce lead free circuits. The most common solution to this problem is to use the traditional PCB manufacturing process with the inclusion of lead free solder, components with higher temperature tolerances and a reflow oven that works at a higher temperature. This method is tried and proven however the costs involved are quite high. Water proof – Electronics circuits made using CiP technology are water proof, thereby resulting in significant cost savings. Traditionally water proof enclosures cost twice the total product cost. Finally there is no need of additional packaging to the circuit as packaging is part of the base circuit board. Complex 3D shaped circuits can be made using CiP.

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